3 d optical profiler

ContourX - 500.

ContourX family desktop flagship model, automatic design and take the sample of the encoder, the head tilt design, and AcuityXR achieve high lateral resolution

Bright spot

ContourX - 500.

ContourX - 500 optical profiler is the world's function is the most comprehensive automation desktop system, can quickly complete non-contact 3 d surface measurement.ContourX - 500.具有卓越的 Z 轴分辨率和准确度,并具备布鲁克落地式白光干涉(WLI)仪器广受业界认可的所有优势,而占地面积更小。该款轮廓仪可轻松自主配置,适用于从精密加工表面和半导体工艺的质量保证/质量控制(QA/QC)计量到眼科和微机电系统(MEMS)器件的研发表征等广泛的复杂应用。

Tilt/pitch
The optical head
Rotating probe measuring surface characteristics for different angles, minimizing the tracking error.
The most advanced
The user interface
To provide a large number of preprogrammed filter and analysis program called directly.
integrated
Air flotation isolation
Provide the best measurement accuracy in compact space.
Click here to download the datasheet ContourX - 500 and full ContourX family brochure.
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The characteristics of

The characteristics of

Designed for excellence desktop measurement

Brooke proprietary optical head tilt/pitch technology, production set up and test for the user to provide great flexibility.Brooke will automatically tilt/pitch function combined with microscopic lens in the optical path, realize the combination of the testing point and the line of sight, is not affected by slope, thus reducing operator intervention, to provide maximum repeatability.Other hardware workbench function including innovation design, can promote splice ability;Equipped with a 5 mp camera, and USES the 1200 x1000 measuring array, can reduce the noise and expand the field of view and improve the lateral resolution.ContourX - 500.将这些功能与自动化平台设置和物镜相融合,而且仅占较小的空间,成为“按需测量”研发和工业计量的理想系统。

The traditional pitch rolling workbench design five axis of rotation, operators need to adjust measure to keep testing point on the line of sight.Brooke unique design of optical head tilt/pitch is not affected by slope, can keep eye on the check point, to optimize the image acquisition, and sharply shorten data access time.

Use a variety of analysis directly

Analysis of microfluidic devices at the bottom of the channel, through the Vision64 multiple regions of the direct extraction.

ContourX - 500 using brooke simple and powerful VisionXpress ™ and Vision64 ® user interface, providing thousands of custom analysis to improve the efficiency of the laboratory and factory.Brooke new general scanning interference (USI) can provide fully automatic, self awareness in the measurement model surface texture, optimization of signal processing, the surface morphology of the analyzed to perform the most accurate and practical calculation.

application

application

Surface - Independent Metrology with Application - Specific Solutions

Precision Engineering

Keep the surface texture and geometric dimensions of precision - engineered parts within tight specification limits. Our gage - capable measurement systems dojo.provide efficient feedback and reporting as you monitor, track, and evaluate the processes and assess GD&T conformance.

MEMS and Sensors

Perform high - throughput, highly repeatable etch the depth, film thickness, step - height, and surface roughness measurements, as well as the advanced critical dimension metrology of MEMS and optical MEMS. Optical profiling can characterize devices throughout the manufacturing process from wafer to final test, and even through the transparent packaging.

Orthopedics/Ophthalmics

Obtain precise and repeatable measurements of impla雷竞技网页版nt materials and components through the complete product life cycle. Our index optical profilers support R&D, QA, QC and analyses, the for applications held characterization of surface parameters of lens and injection molds to surface finish verification and wear of medical devices.

Tribology

The Measure, analyze, and control the impact of friction, wear, lubrication, and corrosion on the material/component performance and lifespans. Determine policy wear parameters and perform fast pass/fail inspections on the widest range of shiny, smooth, or rough surfaces.

Semiconductors

Improve yield and reduce costs for both front and back - end manufacturing the processes with automated, non - contact, wafer - scale metrology systems. Perform post - CMP die flatness inspection;Bump height, coplanarity, and defect identification and analysis;And measure the critical dimensions of component structures.

called

Better understand the root causes of the defects and optimize polishing and finishing the processes with accurate and repeatable sub - nm roughness measurements. Our non - contact metrology systems enable the compliance with his stringent specifications and ISO norms for samples held small aspheric and free - form called, to optical components with complex geometries', to diffraction gratings and microlenses.

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